Equipment | Sputtering Equipment

Sputtering Equipment

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques.
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Equipment
Desk Series Sputtering System from Denton Vacuum
The Desk V HP series is used extensively for scanning electron microscope (SEM), transmission electron microscope (TEM) sample preparation and Iridium coating applications. The Desk V HP series includes standard high power systems and turbo pumped systems.
900 Series Sputtering Batch System from KDF Electronics
The 900 Series features dual load lock, in-line, sputter down, batch systems configured with an optional high vacuum load lock and three or four target positions.
600 Series Sputtering Batch System from KDF Electronics
The 600 Series features dual load lock, in-line, side sputtering batch systems.
Desktop Pro Sputtering System from Denton Vacuum
Compact, High Performance Sputtering Platform. The Desktop Pro provides high performance sputtering in a compact and economical system.
TriAxis Sputtering System from Semicore
Semicore’s TriAxis systems utilize a cost-effective “open platform” design that is easily configured to suit a variety of thin film deposition applications, typically for R&D or small batch production.
Impel PVD Multi-Chamber Deposition System from Semicore
Semicore’s Impel PVD systems utilize a cost-effective modular design that is easily configured to suit a variety of thin film deposition applications, typically for R&D or small batch production.
ATC Orion Series Sputtering Systems from AJA International
The AJA International, Inc. ATC ORION Series Sputtering Systems are compact versions of the popular ATC Series designed to deliver maximum performance for limited budgets.
MVT-8X Series Sputtering System from MAT-VAC Technology, Inc.
Evolved from the popular MRC 8667 and MRC 8671, the MAT-VAC 8X Series Universal Sputterer™ automated cylindrical chamber R&D/ Pilot Production batch sputtering systems feature horizontal "Sputter Down" mode of sputtering in three or four target positions, DC magnetron, RF magnetron and RF diode sputtering mode capabilities at each target position.